The most common method of slicing a silicon ingot is the use of a slurry wiresaw which utilizes an abrasive and liquid vehicle. GNP Ceramics understands and provides the products demanded in the semiconductor and ever growing photovoltaic market. The recent trend in wire sawing is to use finer and finer average particle sizes to minimize kerf loss and sub-surface damage. Utilizing our partnership with Nanko Abrasives allows us to supply superior quality silicon carbide products with strict control of coarse and ultra fine particles. With Nanko's ever increasing capacities, coupled with their world class processing, we are able to service all your wiresaw demands - quality and quantity.